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What exactly is reballing? Engineers design bga circuits to ensure full contact between the chip and the circuits drawn on the board. Due to reasons such as heating and stress, the connections formed by solder balls break over time, and these need to be renewed to maintain the operation of bga chips. During the reballing process all the solder balls which aged are removed and replaced with new ones. Reballing is typically performed on the motherboards of computers, laptops, and gaming consoles. It's usually the chip on the video card that is the problem piece. The soldered connections on this chip deteriorate over time, and in most cases need to be repaired. Corrupted solder joints come up with a variety of problems. Sometimes, while playing games or watching a video, the computer screen suddenly turns black, and nothing but a blank screen. You may have a similar problem with your computer as well as a game console. Vertical-horizontal lines or dots that appear on the entire screen may also be caused by faulty solder connections. Sometimes even that is why your system cannot be booted. Why do bga chips need reballing? There are four main reasons why bga chips need to be reballing. After excessive or prolonged use, the solder connections between the chip and the circuit board loosen. Bga chips may be faulty and need to be replaced with new ones. Sometimes the motherboard that houses the circuit board needs a bga chip upgrade. The solder balls are also affected by the heat and become loose and wiggly. This situation, which also causes solder bridge formation in some cases, causes the parts to deteriorate. Necessary materials it is necessary to state that reballing is not as easy as it seems and a lot of tools, materials are needed. And these equipment needed are not cheap in general. So there are quite a few that do this work in their home. You need a bga kit and a bga rework machine, both of which you can buy online. These tools are essential for the reballing process. Below you will find all the materials needed for the process and a list of what they are used for. Soldering iron – it is the hand tool used for the soldering process. It is the equipment that provides the heat to melt the solder metal. Melted solder flows to the deteriorated connections between the circuit board and electronic components. The soldering iron consists of a metal head that heats up and a tip coated with a non-conductive substance for holding. Solder paste – solder paste is frequently used by manufacturers. It ensures the integration of electronic components or solder balls in an assembled area. It also prevents the formation of metal oxides. Desoldering wick – desoldering wick removes all solder from a solder joint by absorbing the solder into the component on the metal. Bga chip container – these containers are designed to securely hold chips during the reballing process. Bga chip mold set (stencil) – the chip mold is a metal sheet with many slots for solder balls on it. It is made of high quality steel and can be directly heated by a hot air gun or bga machine to effectively and quickly fit the solder balls. Solder balls – the primary role of solder balls is to establish the connection between the chip package and the circuit board. Bga rework machine – it is a machine that provides the necessary heat to place or remove bga chips. Reballing processin this article, the reballing process of ps3 graphics chip will be introduced as an example. It is intended to give you an idea of ​​the process. We recommend you to do the reballing job if possible with the help of a professional engineer, with long and hard process. Then, you need to remove the metal heat sheet on the graphics chip on the motherboard. Using a thin blade, carefully separate this layer from the surface of the chip. If you encounter problems during this step, you can use a heat gun to heat the upper part of this layer, and after sufficient heating, you can try again with a knife. After removing the metal heat sheet, you need to clean the surface of the video chip with 90% pure isopropyl alcohol. You can easily do this using an ear cleaning stick. Then you must coat every corner of the graphics chip with liquid solder paste. This will help you during the desoldering process. You need to use aluminum foil to cover the parts of the motherboard except the graphics chip. End the heat sensor wire on one edge of the graphics chip. Thus, you will be able to monitor the temperature status of the chip. Place the motherboard on the bga rework station and tighten the holding panels to ensure proper placement. We have reached the stage where you will perform the reballing process. In this step, you need to cover the chip with the heater and adjust the machine temperature according to the process time. For example, you can set a moderate temperature for 1 minute for the ps3 graphics chip, and then suddenly increase the temperature to 250 degrees for the next 1 minute. After that, you will see that the solder has melted and the chip can be easily pushed out with the help of a chip holder. If the chip doesn't come off you can give it more heat to get it off. After removing the chip, you'll need to apply some solder paste to the bga surface. With the help of a soldering iron, you can clean the solder left on the surface of the circuit board. Heat the animal up a little and run it over the circuit board. Cut a piece of desoldering wick and place it on the surface of the circuit board. Then run the desoldering wick over the chip using the animal. You will see the remaining solder pool on the desoldering wick and the surface is cleaned.